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(XXI) Communication Equipment, Computer and Other Electronic Equipment Manufacturing
1. Manufacturing of HD digital cameras and digital sound playing equipment
2. Manufacturing of TFT-LCD, PDP, OLED and other panel displays and materials of displays (excluding TFT-LCD glass substrate for the 6th generation and below)
3. Manufacturing of key parts for large-screen color projection displays, including but not limited to optical engines, light sources, projection screens, high-resolution projection tubes, and micro-display projection modules
4. Manufacturing of digital audio and video coding and decoding equipment; equipment for digital broadcasting and television studios; equipment for digital cable television systems; digital audio broadcasting transmission equipment; digital television up-and-down converters; digital television ground broadcasting single frequency network (SFN) equipment; equipment for satellite digital TV uplink stations; and front-end equipment for satellite master antenna television (SMATV)
5. Design of integrated circuits; manufacturing of large-scale digital integrated circuits with a line width of 0.18 microns or less; manufacturing of analog or digital-analog integrated circuits with a line width of 0.8 micron or less, MEMS and compound semiconductor integrated circuits; and BGA, PGA, CSP, MCM, and other advanced encapsulation and testing
6. Manufacturing of large- and medium-sized electronic computers, high-performance computers with a computing capacity of 100 trillion calculations per second, portable minicomputers, high-class servers with a computing capacity of one trillion calculations or more per second, large analog simulation systems, and large industrial controlling machines and controllers
7. Manufacturing of computer digital signal processing system and boards
8. Manufacturing of graphic and image recognition and processing system
9. Development and manufacturing of high-capacity optical and disk drives and their components
10. Manufacturing of high-speed memory system and intelligent memory device with a capacity of 100TB or more
11. Manufacturing of computer-aided design (three-dimensional CAD) systems, computer-aided testing (CAT) systems, computer-aided manufacturing (CAM) systems, computer-aided engineering (CAE) systems, and other computer application systems
12. Development and production of software products
13. Development and manufacturing of materials exclusively for electronic purposes (excluding development and manufacturing of optical fiber performs)
14. Manufacturing of equipment, testing instruments, tools, and molds exclusively for electronic purposes
15. Manufacturing of new electronic parts and components: chip components, sensitive components and sensors, frequency control and selection components, hybrid integrated circuits, power electronic devices, optoelectronic devices, new electromechanical components, polymer solid capacitors, super-capacitors, passive integrated components, high-density interconnect (HDI) boards, flex printed circuit (FPC) boards, rigid-flex printed circuit (R-FPC) boards, and packaging boards
16. Manufacturing of touch control system (touch control screens, touch components, etc.)
17. Manufacturing of high-brightness light-emitting diodes (LEDs) with luminous efficiency of more than 1,001 m/W, LED epitaxial wafers (blue light) with luminous efficiency of more than 1,001 m/W, and white luminous tubes with luminous efficiency of more than 1001m/W and power of more than 200mW
18. Development and production of key parts of high-density digital disk drives
19. Production of read-only disks and recordable disks
20. Design and manufacturing of civil satellites (Chinese parties as controlling shareholders)
21. Manufacturing of civil satellite payloads (Chinese parties as controlling shareholders)
22. Manufacturing of parts and components of civil satellites
23. Manufacturing of equipment for satellite communication systems
24. Manufacturing of satellite navigation and positioning receiving equipment and its key components
25. Manufacturing of optical communication measuring instruments and optical transceivers with a speed of 10 Gb/s or more
26. Manufacturing of ultra-wideband (UWB) communication equipment
27. Manufacturing of equipment for wireless local area networks (including WAPI support) and wide area networks
28. Manufacturing of time division multiplex equipment (TDM) with rate of 40Gbps or more, dense wavelength division multiplexing equipment (DWDM), broadband passive network equipment (including EPON, GPON, WDM-PON, etc.), next-generation DSL silicon and equipment, optical cross connect (OXC) equipment, automatically switched optical network (ASON) equipment, and transmission equipment for optical fiber communication at more than 40G/sSDH
29. Development and manufacturing of IPv6-based next generation Internet system equipment, terminal equipment, testing equipment, software, and chips
30. Development and manufacturing of the third generation and subsequent mobile communication cell phones, base stations, core network equipment, and network testing equipment
31. Development and manufacturing of high-end routers and network switches of one gigabit or more
32. Manufacturing of equipment for air traffic control systems (limited to Chinese-foreign equity or contractual joint ventures)